Microducts bundles - new at SPUR a.s. company
Multiducts bundles are mostly designated for more effective FTTH deployment.
Multi DB bundles of thick walled microducts(optional configurations) have high crush resistence and so can be directly buried into the ground without any protection. Thin jacket allows easy access to individual microducts, followed branching and lead to accessories savings.
![]() |
Multi DI bundles of thin walled microducts (optional configurations) with thin jacket (on the base of LDPE) need to have extra protection. Therefore are mostly pulled into pre-installed subducts.
-
SPUR a.s.
Specialized plastic products, piping systems, cable protectors, insulating materials made of polyethylene foam, packaging material, bubble wrap,...
Remarkplast Slovakia: Two decades of reliability in the heart of Central Europe
22.6.2026 The Slovak subsidiary of the Remarkplast holding is celebrating 20 years since its founding. Over that time, what began as a regional plant has grown into a key part of one of Central Europe's largest thermoplastics processors.
