Oerlikon HRSflow will present hot runner system for small applications at FAKUMA
At Fakuma 2021 (Hall A2 Booth A2-2217) Oerlikon HRSflow will be presenting the new cylinder and nozzle range for small applications. Among the advanced pin control solutions available at the booth, the FLEXflow Evo Technology and its most promising application trends including family molds and back-injection of films.
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Oerlikon HRSflow
Design and manufacture of hot runner systems, SLM inserts, selective laser dissolution, temperature control devices, temperature controllers, hot...
The AMPER 2025 trade fair highlighted the importance of the electrical engineering industry
30.4.2025 From March 18 to 20, 2025, the Brno Exhibition Centre hosted a key event for electrical engineering, electronics, and energy — the 31st edition of the internationally significant AMPER trade fair, organized by TERINVEST.