Microducts bundles - new at SPUR a.s. company
Multiducts bundles are mostly designated for more effective FTTH deployment.
Multi DB bundles of thick walled microducts(optional configurations) have high crush resistence and so can be directly buried into the ground without any protection. Thin jacket allows easy access to individual microducts, followed branching and lead to accessories savings.
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Multi DI bundles of thin walled microducts (optional configurations) with thin jacket (on the base of LDPE) need to have extra protection. Therefore are mostly pulled into pre-installed subducts.
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SPUR a.s.
Specialized plastic products, piping systems, cable protectors, insulating materials made of polyethylene foam, packaging material, bubble wrap,...
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The nanotechnology company SPUR has launched a new line for the production of respirators
SPUR a.s. put into operation a fully automated line for the production of FFP2 respirators. Also the production of veils on the automatic line is already... -
SPUR a.s. thinks ecologically
We have an exclusive interview with Mr. Ondrej Kratka from SPUR a.s. about new packaging of LDPE from renewable natural resources.
