Microducts bundles - new at SPUR a.s. company
Multiducts bundles are mostly designated for more effective FTTH deployment.
Multi DB bundles of thick walled microducts(optional configurations) have high crush resistence and so can be directly buried into the ground without any protection. Thin jacket allows easy access to individual microducts, followed branching and lead to accessories savings.
 |
Multi DI bundles of thin walled microducts (optional configurations) with thin jacket (on the base of LDPE) need to have extra protection. Therefore are mostly pulled into pre-installed subducts.
-
SPUR a.s.
Specialized plastic products, piping systems, cable protectors, insulating materials made of polyethylene foam, packaging material, bubble wrap,...
Development of the Vividi device: custom production of enclosures for smart electronics by cotu s.r.o.
4.7.2025 The goal of the project was to design a compact and technically reliable device that would allow companies to monitor and analyze customer movement within their premises. The challenge was to create a functional design while enabling efficient and...
